Business Prospectus
Electronics industries such as electrical products, electrical parts, printed circuit board (PCB) design, fabrication and assembly. Assembly jigs, testing equipment, plastics, metals, tooling fabrication and other related items.
Firmware/hardware and electronic engineering company that provides engineering services to clients with product test and measurement design needs.
Sole agency for Kamatatecnas & Solar Frontier products.
KAMATATECNAS is researching and developing themes related to water and air. We started business by servicing and maintaining air compressors. Through sales of pneumatic equipment, we developed the WELL AIR compressed air water remover, which we are manufacturing and selling. (http://www.kamatatecnas.co.jp/eng/ )
SOLAR FRONTIER is the world's leading provider of CIS photovoltaic modules. The head office is located in Tokyo, Japan and the production line is located in Miyazaki, the southern part of Japan, where a mild climate and plenty of sunlight is dominant. The production line for CIS modules was commissioned in late 2006, is fully automated and applies the world's most advanced technologies. Solar Frontier has been involved in developing this proprietary technology since 1993 and has become the first world's reliable CIS module manufacturer. ( http://www.solarfrontier.co.jp/ )
ICT Solution & others.
BUSINESS PARTNER
MS PCB (M) SDN BHD
TOP EMPIRE (M) SDN BHD
ORIENTAL COMPONENTS LTD
BUSINESS PROSPECT
1. Electronics industries such as electrical products, electrical parts, printed circuit board (PCB) design, fabrication and assembly.
Assembly jigs, testing equipment, plastics, metals, tooling fabrication and other related items.
2. Firmware/hardware and electronic engineering company that provides engineering services to clients with product test and
measurement design needs.3. Sole agency for Kamatatecnas & Solar Frontier products.
4. ICT Solution.
ORGANIZATION
Managing Director : Mr. Koichi Hagihara
CAPABILITY
A) PRINTED CIRCUIT BOARD FABRICATION
Layer : 2 - 24 v
Min. Spacing : 3.5 mil / 0.09 mm
Minimum via hole diameter : 0.10 mm
Minimum annular ring size : 0.125
Minimum controlled Nickel : 350 u inch / Minimum Controlled Gold : 50 u inch.
Minimum laminate thickness : 0.1 mm / 35 mm copper.
Materials : FR-1, FR2, FR-4, FR-5, CEM-1, CEM-3, Polymide.
ROGERS (High Frequency) & Teflon Materials (Low D.K), Nelco and Taconic.
Others : Blind and Buried Via.
Differential and Impedance Control
B) PRINTED CIRCUIT BOARD ASSEMBLY
Surface Mount, Auto Insert & Manual Line
Product Type : TV (LCD & LED), Telecommunication & Computer Products, Aircond, Microwave Oven, Video.
Machine Capabilities : Fine Pitch Size 0.3 mm QFP, BGA, CSP, Connector.
Minimum Chip Size 0603
Eyelet (4) / Axial (15) / Radial (8) / Sequencer (1) / SMT Line (17) / Manual Insert (4)
CERTIFICATIONS
Printed Circuit Board : UL / TS-16949 / ISO9001:2000 / ISO14001:2004
PCB Assembly : ISO9001:2005 / ISO14001:2008
CUSTOMERS
Samsung / Sony / Sharp / Pioneer / PanasonicOBJECTIVE
FAST EXCELLENT SERVICES, CUSTOMER SATISFACTION WITH QUALITY PRODUCTS AND ON TIME DELIVERY